Despatch cabinet ovens and reach-in ovens are designed for easy loading and unloading. These ovens offer an almost unlimited amount of application possibilities to meet any of your batch processing needs. Cabinet and reach-in ovens provide an efficient footprint and are available in a wide range of chamber sizes.
Despatch’s LCC/LCD2-14 clean process ovens are designed to meet the demands of production and large scale R&D environments. These ovens offer nitrogen atmosphere, HEPA filtration and maintain ISO Class 5 (Class 100) conditions throughout the process cycle. Typical applications for these ovens include die-bond curing and other semiconductor packaging processes, depyrogenation, and sterilization and drying for life sciences. LCC maximum temperature is 260°C (500°F) and LCD maximum temperature is 350°C (662°F).
The PCO2-14™ polyimide cure oven is a clean process oven designed for polyimide baking and curing applications. The PCO2-14™ optimizes the polyimide cure process for semiconductor wafer devices. It enables short cycle times and a consistent, reproducible cure process for all wafers in the product load. The PCO2-14 includes a HEPA filter, real-time graph display and integrated PC and oxygen monitoring system. Nitrogen atmosphere is available and the maximum temperature for the PCO2-14 is 350°C (662°F).
The Qmax high performance cabinet oven is specifically designed to meet the frequent air changes and tight temperature uniformity required of the ASTM 5423 Type I & Type II oven specifications. This oven is ideal for testing, curing, aging and other thermal applications where tight temperature uniformity is required. Maximum operating temperature is 343°C (650°F).
The RA/RF is a versatile reach-in oven that provides exceptional performance in production and laboratory applications such as curing, drying, sterilizing and aging. The oven’s horizontal, recirculating airflow is achieved by utilizing a high-volume fan to circulate air through the perforated stainless steel interior walls. The RF model is available for applications including flammable solvents (per NFPA 86) or large amounts of moisture removal.
The PBC burn-in ovens are engineered specifically for applications such as high dissipation forward bias, high-temperature reverse bias, dynamic and static burn-in of IC, RAM, ROM, microprocessors and other semiconductor devices. This oven offers horizontal airflow and temperatures up to 260°C (500°F).
Custom Cabinet Ovens And Reach-In Ovens
Despatch custom-designed an LNB oven with nitrogen atmosphere and material handling equipment to meet a customer’s unique requirements. The customer’s process required a reliable oven with uniform internal temperatures and accurate ramp and soak time and temperature controls. Despatch’s LNB oven, with its horizontal airflow and superior temperature uniformity, offered the ideal solution. Despatch engineers also custom designed stainless steel trucks to maximize production and reduce material handling.